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Technology, fabrication and industrialization of embedded systems

Objectives

At the end of this module, the student will have understood and be able to explain :
- how to write a specification for the mass production of an embedded system (BOM, Gerber files, BTF, FMEA, ..)
- how to define the technology class of a printed circuit board (PCB rigid, flexible, hybrid)
- how to route the signals taking into account constraints such as heat dissipation and signal integrity
- how to define the board manufacture (single / double layer, size, class)
- how to comply with different standards (NF 93-713, RTTE, DBT, RoHS, WEEE)
- how to set up quality control (ISO17025)
- how to estimate the reliability of the assembly (standard FIDES)
The student will become familiar with all stages of manufacturing, design methods and standards / compliance of a finished electronic product.

Form of assessment

The evaluation of outcome prior learning is made as a continuous training during the semester. According ot the teaching, the assessment will be different: as a written exam, an oral exam, a record, a written report, peers review...